Multi-batch Self-assembly for Microsystem Integration

In this paper, we describe a parts-to-substrate self-assembly approach driven by surface tension. To perform assembly, the substrates are prepared with hydrophobic gold patterns as binding sites. The binding sites are activated by adsorption of an alkanethiolate self-assembled monolayer (SAM), while they can be de-activated by electrochemical reductive desorption of the monolayer. Therefore, assembly can be controlled to take place exclusively at desired activated sites. This assembly process can be repeated to organize different micro parts into a system. We develop and demonstrate a self-assembly protocol, including micro fabrication process, surface modification techniques, and electroplating as a post-assembly process, for the purpose of full system integration and packaging.